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Discover our etching services

Facilities for the dry and wet etching of materials are available as part of our David Bullett Nanofabrication Facility.

Bookable etching equipment

Dry and wet etching equipment available at the David Bullet Nanofabrication Facility

Dry etching equipment at the University of Bath.

Dry etching is performed in our Oxford Plasma Lab 80 plus and Plasma Pro System 100 inductively coupled plasma (ICP) etchers.

Currently, these are configured to use the following gases:

  • O2
  • Ar, CHF3
  • SiCl4
  • Cl2
  • BCl3
  • SF6
  • C4F8

Recipes are also well established to etch GaN, GaAs, Si, SiO2, Si3N4 and many thin metallic films. We also have an Ar ion miller for the dry etching of chemically stable material.

In addition, we have broad experience with various wet chemical etchants. For example, HF-based solutions are routinely used to etch novel photonic glass fibres, and KOH-based solutions are used to etch Si.

Contact us

If you have any questions about our etching facilities, or would like to book them, please get in touch.