A variety of thin film deposition systems are available. These include thermal or electron-beam evaporators, a magnetron sputter coater and plasma-enhanced chemical vapour deposition (PECVD).
Moorfield Minilab E080A electron beam evaporator
Our Moorfield Minilab E080A electron beam evaporator can accommodate eight evaporation sources and has a load-lock system for rapid throughput of samples. It can deposit a range of metals including; Al, Cu, Ni, Ti, Pt, PD Cr, Mo, W and dielectrics including SiO2 and ITO.
The Edwards FL-400 electron beam evaporator is also available.
Moorfield Minilab T060M thermal evaporator
Our Moorfield Minilab T060M thermal evaporator has four evaporation sources and can deposit thin metal films including: Au, Ag, Al Ge, Ni, Cr.
The Edwards Auto 306 thermal evaporator is also available.
Plasma Therm 790 series plasma-enhanced chemical vapour deposition (PECVD) system
Our Plasma Therm 790 series plasma-enhanced chemical vapour deposition (PECVD) system allows the deposition of thin films of SiO2 and SiNx.
HHV sputter coater
Our HHV sputter coater allows DC and RF sputtering, from three sputtering heads, of various thin films. Our current targets include Al, Au, AZO, Co, Cr, FeO2, ITO, Nb, Pt, Py (Ni-Fe), Si3N4, SiO2, Ta, Ti, TiO2, WO3, Zn, and ZnO. The system also allows for substrate heating, reactive sputtering with O2 and co-sputtering with simultaneous DC and RF sputtering.
